Solder Paste
M8 SN63/PB37 T4 No Clean Solder Paste
An evolution of the highly successful NC258 platform, M8 brings no clean solder paste performance to the next level. Developed in combination with T4 and finer mesh leaded alloy powders, M8 provides stable transfer efficiencies required for today’s UFP and umBGA devices, reducing DPMO on the most challenging applications.
$110.00
M8 SAC305 T4 No Clean Lead Free Solder Paste
An evolution of the highly successful NC258 platform, M8 brings no clean solder paste performance to the next level. Developed in combination with T4 and finer mesh leaded alloy powders, M8 provides stable transfer efficiencies required for today’s UFP and umBGA devices, reducing DPMO on the most challenging applications.
$125.00
WS488 T4 Water Soluble Solder Paste
AIM’s WS488 water soluble paste has been designed to wet virtually any solderable electronic surfaces, components, assemblies, and substrates. WS488 is compatible with all leaded and lead-free alloys, and has been developed for use in a wide range of applications.
$105.00
WS488 T4 Water Soluble Lead Free Solder Paste
AIM’s WS488 water soluble paste has been designed to wet virtually any solderable electronic surfaces, components, assemblies, and substrates. WS488 is compatible with all leaded and lead-free alloys, and has been developed for use in a wide range of applications.
$135.00
