Solder Paste
NC676 No Clean Solder Paste
The NC676 No Clean Paste is a new generation halide-free, rosin-based chemistry designed to provide a previously unseen level of repeatability and consistency to the printing process. This paste offers an excellent open time, extended abandon time and good soldering activity with all surface finishes. NC676 meets or exceeds the requirements for ANSI/J-STD -004, -005 as well as all Bellcore test criteria for solder pastes. Residues left behind are clear and maintain a virtually indefinite pin probability life.
$15.00
In stock and ready for shipment
WS888 Water Soluble Lead Free Solder Paste
The WS888, manufactured by FCT Solder, displays previously unseen levels of repeatability and consistency even in a wide range of temperatures (65°-85°F) and relative
humidity (25% - 65% RH). Commonly used in printed circuit board assembly.
|
|
$25.00
In stock and ready for shipment
WS159 Water Soluble Solder Paste
The WS159, manufactured by FCT Solder, is designed to provide humidity tolerance and excellent wetting to meet the requirements
for reliable solder joints in printed circuit board assemblies.
|
|
$15.00
In stock and ready for shipment
NL932 No Clean Lead Free Solder Paste
The NL932, manufactured by FCT Solder, delivers Surface Area Ratio (SAR) paste transfer efficiencies below 0.6 and 0.55 respectively. NL932 is formulated to deliver
exceptional cosmetics, especially when used in conjunction with Nihon Superior’s SN100C patented lead free alloy. It was specially designed to meet the requirements for reliable solder joints in printed circuit board assemblies.
|
|
$25.00
In stock and ready for shipment
